Wet out bonding surfaces and apply thickened epoxy. Re-wet very porous surfaces and end grain. 3M Scotch-Weld Hot Melt Adhesive is advance hand held system to help you improve productivity, lower cost, and minimize waste. They cool , harden, and reach bond strength in seconds. Add more filler to the mixture until it reaches a «peanut butter» consistency; the more filler added, the stiffer and easier it will be to sand. Use 800 Roller Covers and roll the coating out into a thinner film. A thin film will flow out much smoother than a thicker film after it is tipped off with the foam roller brush. Clean and sand the surface following the procedure in the User Manual.
Acheson ELECTRODAG 503 High temperature silver conductive coating ACHESON ELECTRODAG 5915 ACHESON ELECTRODAG 5915 is a one component, fast cure, electrically conductive isotropic ink designed for bonding surface mount devices to flexible or rigid printed circuits. Ablestik C130 supplied in 30 micro thickness enables leadframe package manufacturers to realize the advantages film-based products have over traditional paste die attach products. Increase bonding area by adding fillets, bonded fasteners or scarf joints. See Controlling Cure Time in the User Manual. PROBLEM: Fairing compound (epoxy/407 or 410 mixture) sags and is difficult to sand. POSSIBLE CAUSES & SOLUTIONS: Fairing material is not thick enough. Use a faster hardener, designed to cure at lower temperatures.
See Controlling Cure Time in the User Manual. Hysol ECCOBOND C990 One-component, general conductive, silver-filled epoxy paste adhesive. Mix resin and hardener together thoroughly to avoid resin-rich and hardener-rich areas. Suitable for high heat dissipation devices and solder replacement applications. Hysol FP0116 Hysol FP4531 Hysol FP4531 is a snap cure fast flow, non-reworkable underfill for CSP applications. Applied pre-reflow and allows self-alignment of SMT components during reflow operation.